[DBÇÏÀÌÅØ & DB±Û·Î¹úĨ] °æ·Â»ç¿ø °ø°³Ã¤¿ë (7¿ù)
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- DBÇÏÀÌÅØÀº 1997³â ¼³¸³µÈ ±¹³» ÃÖÃÊÀÇ ½Ã½ºÅ۹ݵµÃ¼ Àü¹®±â¾÷À¸·Î, Àü·Â°ü¸®Ä¨/CIS/RF µî °íºÎ°¡°¡Ä¡ Foundry ¼ºñ½º¸¦ Á¦°øÇÏ°í ÀÖ½À´Ï´Ù.
- DB±Û·Î¹úĨÀº µð½ºÇ÷¹ÀÌ ¼³°è Àü¹®È¸»ç·Î, ¾÷°è °æ·Â 15³â ÀÌ»ó ÀÚü±â¼ú·ÂÀ¸·Î LCD ¹× OLED¿ë Display ±¸µ¿Ä¨(DDI)À» ¼³°è, °ø±ÞÇÏ°í ÀÖ½À´Ï´Ù.
- DB±Û·Î¹úĨÀº DBÇÏÀÌÅØÀÇ ÀÚȸ»ç·Î '23³â 5¿ù 2ÀϺο¡ Brand»ç¾÷ºÎ°¡ ºÐÇÒµÇ¾î »õ·Ó°Ô Ãâ¹üÇß½À´Ï´Ù.
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ȸ»ç ¸ðÁýºÎ¹® ÁÖ¿ä¾÷¹« ÀÚ°Ý¿ä°Ç ±Ù¹«Áö
DB
ÇÏÀÌÅØ Analog & BCD ∙ Analog & BCD ¼ÒÀÚ °³¹ß
∙ CMOS/BJT/DEMOS/LDMOS/Passives ¼ÒÀÚ Æ¯¼º Æò°¡ ¹× ºÐ¼®
∙ Module Process set-up ¹× Full Process Integration
∙ Test Pattern (TEG) Á¦ÀÛ ¹× ¼ÒÀÚ characterization
∙ Design Rule doc. ¹× PDK deliverables Á¦ÀÛ [Çʼö]
∙ Analog & BCD ¼ÒÀÚ°³¹ß °æ·Â 2³â ÀÌ»ó(¼®»ç), 4³â ÀÌ»ó(Çлç)
[¿ì´ë]
∙ TCAD Simulation tool È°¿ë ¼÷·ÃÀÚ °æ±â
(ºÎõ)
LV/MV MOSFET ∙ LV/MV MOSFET Cell & Ring Design
∙ Test pattern ¼³°è ¹× Layout
∙ Trench Gate Module Process set-up ¹× Full Process Integration
∙ Static & Dynamic Test ¹× Characterization [Çʼö]
∙ PowerDevice/Á¦Ç°°³¹ß °æ·Â 3³â ÀÌ»ó(¼®»ç), 5³â ÀÌ»ó(Çлç)
∙ TCAD »ç¿ë °¡´ÉÀÚ
[¿ì´ë]
∙ Data-sheet Á¦ÀÛ ¹× Board ½ÇÀå Test À¯°æÇèÀÚ °æ±â
(ºÎõ)
BCD
¼ÒÀÚ°³¹ß ∙ BCD ¼ÒÀÚ°³¹ß
∙ ¼ÒÀÚ Æ¯¼º Æò°¡ ¹× ºÐ¼®
∙ Process Integration [Çʼö]
∙ Power Device/Á¦Ç°°³¹ß °æ·Â 2³â ÀÌ»ó(¼®»ç), 4³â ÀÌ»ó(Çлç)
[¿ì´ë]
∙ ¼ÒÀÚ Design ¹× Process Set-up °æÇèÀÚ ÃæºÏ
(À½¼º)
CMOS
¼ÒÀÚ ¹× °øÁ¤°³¹ß ∙ CMOS Process Integration
∙ CMOS & Passive ¼ÒÀÚ ¹× °øÁ¤ °³¹ß
∙ ¼ÒÀÚ Æ¯¼º Æò°¡ ¹× ºÐ¼®, °³¼±
∙ TCAD, Mask Work, TEG Design & Layout
∙ Á¦Ç° °³¹ß ¹× ºÒ·® ºÐ¼®, °øÁ¤ ¾ÈÁ¤È, ¼öÀ² °³¼±
∙ PDK °³¹ß ¹× °ü¸® [Çʼö]
∙ PI(Process Integration) °æ·Â 2³â ÀÌ»ó(¼®»ç), 3³â ÀÌ»ó(Çлç)
[¿ì´ë]
∙ RF °ü·Ã Àü°øÀÚ
∙ PDK °³¹ß °æÇèÀÚ ÃæºÏ
(À½¼º)
DDI °øÁ¤°³¹ß ∙ DDI °øÁ¤ ¹× Á¦Ç° °³¹ß (ITÇâ/TVÇâ °øÁ¤)
∙ ¼ÒÀÚ Æ¯¼º Æò°¡ ¹× ºÐ¼®, °³¼±
∙ °øÁ¤ À̽´ ºÐ¼® ¹× °³¼±
∙ TCAD, Mask Work, TEG Design & Layout
∙ Á¦Ç° °³¹ß ¹× ºÒ·® ºÐ¼®, °øÁ¤ ¾ÈÁ¤È, ¼öÀ² °³¼±
∙ PDK °³¹ß ¹× °ü¸® [Çʼö]
∙ PI (Process Integration) °æ·Â 2³â ÀÌ»ó(¼®»ç), 3³â ÀÌ»ó(Çлç)
[¿ì´ë]
∙ DDI °øÁ¤ ¹× Á¦Ç° °³¹ß °æÇèÀÚ
∙ PDK °³¹ß °æÇèÀÚ ÃæºÏ
(À½¼º)
CIS Pixel & SPAD °³¹ß ∙ CIS Pixel & SPAD °øÁ¤ °³¹ß
- Process Integration
- Electrical Data Analysis
- TCAD Simulation [Çʼö]
∙ CMOS Image Sensor ¶Ç´Â Process Integration °æ·Â 3³â ÀÌ»ó
[¿ì´ë]
∙ Matlab ¶Ç´Â DC Test ´É¼÷
∙ TCAD Simuluation 2³â ÀÌ»ó ÃæºÏ
(À½¼º)
PDK °³¹ß
(Ruledeck) ∙ DRC/LVS/LPE Ruledeck °³¹ß/°ËÁõ ¹× °í°´ ±â¼ú Áö¿ø [Çʼö]
∙ ÀüÀÚ °øÇÐ °è¿ Àü°ø (ÇÐ»ç ¶Ç´Â ¼®»ç ÀÌ»ó)
∙ ¹ÝµµÃ¼ ¼ÒÀÚ ¹× °øÁ¤ÀÇ ÀÌÇØ Áö½Ä º¸À¯
∙ Calibre (Siemens»ç) DRC/LVS/LPE Ruledeck °³¹ß ´É·Â º¸À¯
[¿ì´ë]
∙ Cadence/Synopsys»ç DRC/LVS/LPE Ruledeck °³¹ß °æÇèÀÚ
∙ Unix/Linux ȯ°æ °æÇèÀÚ
∙ Programming Language (Python, C/C++, Tcl/Tk)¸¦ È°¿ëÇÑ °³¹ß/°ËÁõÀ» À§ÇÑ Utility °³¹ß
∙ ¾Æ³¯·Î±×/µðÁöÅÐ ¼³°è °ü·Ã EDA Tool »ç¿ëÀÚ
- EDA Tool - Schematic/layout Editor(Virtuoso), Verification (Assura/PVS, ICV)
∙ ¹ÝµµÃ¼ ¼ÒÀÚ °³¹ß ¹× ¾Æ³¯·Î±×/µðÁöÅРȸ·Î ¼³°è °æÇèÀÚ
∙ °ü·Ã ¾÷¹« °æ·ÂÀÚ (2³â ÀÌ»ó) °æ±â
(ºÎõ)
¾ç»ê°³¹ß
(Process
Integration) ∙ À̹ÌÁö ¼¾¼(CMOS Sensor) Á¦Ç°ÀÇ ¾ç»ê °ü¸® ¹× Ç°Áú°ü¸®
∙ CIS Pixel Ư¼º Æò°¡, ¼öÀ² ºÐ¼®, ±¤Æ¯¼º ºÐ¼® ¹× °³¼± ¾÷¹«
∙ CIS Á¦Ç°ÀÇ °í°´ ´ëÀÀ ¾÷¹«
∙ ¹ÝµµÃ¼ ¼ÒÀÚ ºÒ·®ÀÇ ºÐ¼® ¹× °³¼± È°µ¿ ¾÷¹« [Çʼö]
∙ ¹ÝµµÃ¼ ÁÖ¿ä Fab process¿¡ ´ëÇÑ Áö½Ä / ÀÌÇØ ´É·Â
∙ ¹ÝµµÃ¼ ¼ÒÀÚ ºÐ¼® / °³¼± È°µ¿ °æÇè
∙ ¹ÝµµÃ¼ Á¦Ç°ÀÇ ºÐ¼® / ¼öÀ² °ü¸® °æÇè
∙ ÀüÀÚÀü±â / ¹°¸® / Àç·á / È°ø(ÀÌ°ø °è¿)
[¿ì´ë]
∙ ¼¾¼ ±â¼ú °æÇèÀÚ
. ±¤Æ¯¼º ÀÌÇØ ¹× °æÇèÀÚ
∙ Pixel ±¸Á¶ ¹× ȸ·Î °æÇèÀÚ
∙ ¿Ü±¹¾î ¿ì¼öÀÚ(¿µ¾î, Áß±¹¾î µî) ÃæºÏ
(À½¼º)
µ¥ÀÌÅÍ
»çÀ̾ðƼ½ºÆ® ∙ µ¥ÀÌÅÍ »çÀ̾𽺠ÇÁ·Î¼¼½º Á¤¸³
∙ »ý»ê°øÁ¤/Àåºñ µ¥ÀÌÅÍ ÃßÃâ, °¡°ø, ºÐ¼®
∙ Åë°è ¹× ¸Ó½Å ·¯´× ±â¹ýÀ» »ç¿ëÇÏ¿© µ¥ÀÌÅÍ ºÐ¼®
∙ »ý»ê°øÁ¤/Àåºñ ¿£Áö´Ï¾î¿Í Çù¾÷À» ÅëÇØ ¹®Á¦ ÇØ°á [Çʼö]
∙ Data Science °ü·Ã Çлç ÀÌ»ó
∙ 3³â ÀÌ»óÀÇ °ü·Ã Á÷¹« °æ·Â
∙ SQL, Python, R, Java µîÀ» È°¿ëÇÑ ºòµ¥ÀÌÅÍ ÃßÃâ, ºÐ¼®, ¸ðµ¨¸µ ¼³°è ¹× Àû¿ë °¡´ÉÀÚ
∙ Data Pipeline Management Tool ±¸Ãà ¹× ¿î¿µ °¡´ÉÀÚ
[¿ì´ë]
∙ Åë°è, µ¥ÀÌÅÍ °ü·Ã ¹Ú»ç ÇÐÀ§ ¼ÒÁöÀÚ
∙ ¹ÝµµÃ¼ »ê¾÷ ºòµ¥ÀÌÅÍ ºÐ¼® °æÇè 5³â ÀÌ»óÀÚ °æ±â
(ºÎõ)
AI ¸ðµ¨ °³¹ßÀÚ ∙ ¸Ó½Å·¯´×/µö·¯´×À» ÀÌ¿ëÇÑ ¸ðµ¨ °³¹ß ¹× ¿î¿µ
∙ ¸ðµ¨ ¼º´É °³¼± ¹× ¿î¿µ, ¹èÆ÷ ¹× À¯Áöº¸¼ö
∙ DT È®»ê ¹× ´Ü°èº° È¿°ú °ËÁõ
∙ ½Å±Ô °úÁ¦ µµÃâ ¹× Çö¾÷ ºÎ¼¿Í Çù¾÷ [Çʼö]
∙ Data Science °ü·Ã Çлç ÀÌ»ó
∙ 3³â ÀÌ»óÀÇ °ü·Ã Á÷¹« °æ·Â
∙ ¸Ó½Å·¯´× ¹× µö·¯´×¿¡ ´ëÇÑ ÀÌÇØ¿Í »ç¿ë °æÇè
∙ Python, TensorFlow, PyTorch µîÀ» »ç¿ëÇÑ ÇÁ·Î±×·¡¹Ö ±â¼ú
[¿ì´ë]
∙ Åë°è, µ¥ÀÌÅÍ °ü·Ã ÀÚ°ÝÁõ º¸À¯ÀÚ
∙ AI ¸ðµ¨ °³¹ßºÎÅÍ ¼ºñ½º ±¸Çö °úÁ¤¿¡ Âü¿© ¹× ¸®µù °æÇè °æ±â
(ºÎõ)
À繫
(ȸ°è/¼¼¹«) ∙ ¿¬°áÀ繫Á¦Ç¥ °á»ê ¹× ¿ÜºÎ°¨»ç ´ëÀÀ
∙ ¼¼¹« °ËÅä ¹× ¹ýÀμ¼ ½Å°í
∙ ȸ°è/¼¼¹« À̽´ ´ëÀÀ [Çʼö]
∙ »ó°æ°è¿(°æ¿µÇÐ/ȸ°èÇÐ) Àü°øÀÚ
∙ Á¦Á¶¾÷ ȸ°è/¼¼¹« °æ·Â 5³â~10³â
∙ ¿¬°áÀ繫Á¦Ç¥ °æ·Â(±¹³»/¿Ü °è¿»ç)
[¿ì´ë]
∙ KICPA ÀÚ°ÝÁõ ¼ÒÁöÀÚ °æ±â
(ºÎõ)
DB
±Û·Î¹úĨ ESD ¼ÒÀÚ°³¹ß ∙ ESD ¼ÒÀÚ°³¹ß
- ESD Device Solution
- °øÁ¤ ESD/Latch-up °ËÅä
∙ Á¦Ç° ESD¼³°è
- ESD Device & Network Guide
∙ ºÒ·®ºÐ¼®
- ESD Device & Product FA [Çʼö]
∙ ESD ¼ÒÀÚ °³¹ß °æÇè ¶Ç´Â Á¦Ç° Level ESD ¼³°è °æÇè º¸À¯
3³â ÀÌ»ó(¼®»ç), 5³â ÀÌ»ó(Çлç)
[¿ì´ë]
∙ Á¦Ç° ESD Æò°¡/ºÐ¼®/ÇØ°á´É·Â º¸À¯ÀÚ
∙ Layout ´É·Â º¸À¯ (UDD/Skill Program ´É·Â)
∙ ÇÁ·Î±×·¡¹Ö ¿ì¼öÀÚ (C++, Phython µî) °æ±â
(ÆDZ³)
PMIC ¼³°è ∙ PMIC Chip ¹× Block ¼³°è
- DCDC converter, LDO, Level shifter µî Chip ¼³°è
- OPamp, BGR, Reference, OSC., DAC block ¼³°è
- Layout ¼³°è guide, Test plan ÀÛ¼º
∙ PMIC specification ¹× Inteface °ËÁõ
- Single wire, SPI, I2C Interface ¼³°è °ËÁõ
∙ PMIC ºÒ·® ºÐ¼®
- Function error, damage, ESD µî ºÒ·® ºÐ¼® [Çʼö]
∙ Power IC, PMIC ¼³°è °æ·Â 8³â ÀÌ»ó
∙ Çϱâ Á¦Ç° Áß 1~2 Á¦Ç° ´Üµ¶ ¼³°è °¡´É Àοø
[Á¦Ç°±º] DCDC converter IC (Boost/Buck/Buck-boost),
Charge Pump IC, Level shifter IC, Switching Charger IC µî
∙ Display Power ¹× Power analog ´ÜÇ° ¼³°è °æÇè
∙ AMS, XA, HSPICE, SPECTRE Tool »ç¿ë ¼³°è °æÇè
[¿ì´ë]
∙ BCD °øÁ¤ »ç¿ë ¾ç»ê ¹× ºÒ·® ´Ù¼ö °æÇèÀÚ
∙ ESD, EOS ´ëÀÀ ¼³°è °æÇè °æ±â
(ÆDZ³)
PMIC TEST ∙ PMIC Á¦Ç°±º Test Program °³¹ß ¹× Ư¼º Æò°¡
- Wafer Probe (EDS or CP), Final Test
(Assembly or Package Test)
. PMIC Á¦Ç°±º ¾ç»ê Issue ºÒ·® ºÐ¼®
- Àú¼öÀ² ºÐ¼®, RMA ½Ã·á ºÐ¼®, ¿ÂµµÆò°¡,
¿ÜÁÖó Engineering Áö¿ø
. ¿ø°¡ Àý°¨ È°µ¿
- Multi-DUT Setup, Test Time Reduction [Çʼö]
∙ PMIC Á¦Ç°±º Test Program °³¹ß 3³â ÀÌ»ó
∙ PMIC Test °¡´É Àåºñ »ç¿ëÀÚ (T2K, ETS)
[¿ì´ë]
∙ PMIC Á¦Ç°±º Multi-DUT ¾ç»ê °æÇèÀÚ
∙ Perl, C, C++ °¡´ÉÀÚ °æ±â
(ÆDZ³)
DDI ÀÀ¿ë±â¼ú ∙ Display Driver IC Àü±âÀû/±¤ÇÐÀû Ư¼º Æò°¡
- OLED Mobile ¿ë DIC (Tcon Embeded DIC)
- LCD/OLED TV/Monitor/Note PC ¿ë DIC
∙ °í°´ ±â¼ú ¿ä±¸»çÇ× ´ëÀÀ
- IC ºÒ·® ºÐ¼® ¹× Trouble Shooting
- ±¸µ¿ ÃÖÀû Á¶°Ç Tuning [Çʼö]
∙ Display Panel ±¸µ¿ ȸ·Î °ü·Ã °æÇèÀÚ (DDI¼³°è, FAE, CSE µî)
[¿ì´ë]
∙ Display Panel ±¸µ¿ Driver IC Àü±âÀû Æò°¡ °ü·Ã ¾÷¹« °æ·Â 2³â ÀÌ»ó
∙ LCD/OLED Display Module ±¸µ¿ ȸ·Î °³¹ß °æÇèÀÚ
∙ ºñÁî´Ï½º ¼öÁØÀÇ Áß±¹¾î ±¸»çÀÚ
∙ Python, System Verilog, VHDL »ç¿ë °¡´ÉÀÚ °æ±â
(ÆDZ³)
DDI Logic¼³°è [MobileÁ¦Ç°±º]
∙ Mobile Display Driver IC
∙ RTL ¹× Verilog¸¦ ÀÌ¿ëÇÑ Digital Logic ¼³°è
∙ High Speed Interface (MIPI)
∙ Memory Control (Flash/SRAM)
∙ Image Processing / Compression IP
∙ System Verilog / UVM (Universal Verification Methodology)
ȯ°æÀ» ÀÌ¿ëÇÑ Verification
[´ëÇüÁ¦Ç°±º]
∙ ´ëÇü Display Á¦Ç° Mixed Logic Design
- RTL Logic Design
- Full Custom Logic Design [Çʼö]
∙ DDIÁ¦Ç° IC¼³°è °æ·Â 3³â ÀÌ»ó
[¿ì´ë]
∙ Mobile ¶Ç´Â LDDI¿ë Display(LCD/OLED) IC Á¦Ç° ¾ç»ê °æÇèÀÚ
∙ RTL ¾ç»ê °æÇèÀÚ °æ±â
(ÆDZ³)
DDI Analog¼³°è [MobileÁ¦Ç°±º]
∙ Power Design
- LDO, Regulator, DC-DC µî
∙ Source Driver Design
- DAC, Low Power High Speed OP-AMP µî
[´ëÇüÁ¦Ç°±º]
∙ Source Driver Design
- DAC, Low Power High Speed OP-AMP
- ADC Design
- LDO, Regulator, OSC Design [Çʼö]
∙ DDIÁ¦Ç° IC¼³°è °æ·Â 3³â ÀÌ»ó
[¿ì´ë]
∙ Mobile ¶Ç´Â LDDI¿ë Display(LCD/OLED) IC Á¦Ç° ¾ç»ê °æÇèÀÚ
∙ Matlab ÀÌ¿ë Frequency domain Analysis °¡´ÉÀÚ °æ±â
(ÆDZ³)
¡Ø ä¿ë °ü·Ã FAQ´Â ¸µÅ©¸¦ ÂüÁ¶ÇÏ¿© ÁֽʽÿÀ. (https://dbhitek-recruit.com/recruit_faq.php)
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∙ DB±Û·Î¹úĨ: ȸ»ç ȨÆäÀÌÁö(www.dbglobalchip.com) ÇÏ´Ü, Contact Us¿¡¼ ¹®ÀÇ