* JOB Description
MLC(Multi-layer-Ceramic), PCB(Print-Circuit-Board) ¼³°èÀÚ´Â Probe CardÀÇ
ÇÙ½É ±¸¼º ¿ä¼Ò ÀÎ, MLC, PCB¸¦ ¼³°è, °³¹ß ¹× °ü¸®¸¦ ÇÏ´Â Àü¹®°¡·Î½á, ȸ·Î ¼³°è¿Í ±â±¸¼³°è¸¦
MLC¿Í PCB¿¡ ±¸ÇöÇÏ°í, Á¦Ç°ÀÇ ¼º´ÉÀ» ÃÖÀûÈÇϱâ À§ÇÑ ¾÷¹«¸¦ ¼öÇà ÇÕ´Ï´Ù.
1) Multi-layer ±¸Á¶ÀÇ º¹ÀâÇÑ °í¹Ðµµ MLC, PCB ¼³°è ¹× °³¹ß.
2) Signal integrity, power dissipation etc... °í·ÁÇÑ Layout ¼³°è.
[°øÅë»çÇ×] ¼³°è ÇÁ·Î¼¼½º ÃÖÀûȸ¦ À§ÇÑ ¼³°è ÀÚµ¿È ÇÁ·Î±×·¥ °³¹ß/±âŸ À¯°ü ÇÁ·Î±×·¥ tool »ç¿ëÀÚ Ãßõ°¡´É
- ¼³°è °úÁ¤À» Àß ÀÌÇØÇÏ¿©, ºñÈ¿À²ÀûÀÎ Ç׸ñÀ» µµÃâÇÏ°í, °³¼±Çϱâ À§ÇØ È¿°úÀûÀÎ ¾ÆÀ̵ð¾î¸¦ Á¦¾ÈÇÏ°í,
À̸¦ ±¸Ã¼ÈÇÏ¿© ¼³°è ¾÷¹« ½Ã ÇÊ¿äÇÑ ÀÚµ¿È ½Ã½ºÅÛÀ» ±¸Ãà
1. MLC ¼³°è Æ÷Áö¼Ç
PROBE CARD¿¡ »ç¿ëµÇ´Â MLC(LTCC, HTCC)¿Í TAIP ¼³°è
- Allegro ¼³°è ÇÁ·Î±×·¥À» »ç¿ëÇÏ¿©, °í°´ÀÌ ¿äûÇÑ Mechanical, Electrical Spec.À» Àû¿ëÇÑ ¼³°è
- Ceramic Ư¼º°ú DFM(Design For Manufacturing)À» °í·ÁÇÑ Build-up ¼³°è
2. PCB ¼³°è Æ÷Áö¼Ç
PPROBE CARD¿¡ »ç¿ëµÇ´Â PCB(MAIN, SUB) ¼³°è
- Allegro ¼³°è ÇÁ·Î±×·¥À» »ç¿ëÇÏ¿© °í°´ÀÌ ¿äûÇÑ Mechanical, Electrical Spec.À» Àû¿ëÇÑ ¼³°è
- PCB SI/PI Ư¼º°ú DFM(Design For Manufacturing)À» °í·ÁÇÑ Through, BVH, °í´ÙÃþ ¼³°è
[º¸À¯ ¹× Çʿ俪·®/ /±âŸ À¯°ü ÇÁ·Î±×·¥ tool »ç¿ëÀÚ Ãßõ°¡´É]
1. Allegro ¼³°è ÇÁ·Î±×·¥ ¶Ç´Â ´Ù¸¥ CAD ÇÁ·Î±×·¥ÀÇ »ç¿ë °æÇèÀÌ ÀÖ´Â ÀÚ
2. SI/PI simulation Tool »ç¿ë ´É·Â.
3. ¹ÝµµÃ¼ 8´ë °øÁ¤ÀÇ EDS °øÁ¤°ú Wafer test °³³äÀ» ÀÌÇØÇÏ°í ÀÖ´Â ÀÚ