Á¦¸ñ [°øÃ¤] [½ÅÀÔ/°æ·Â] Á¦Á¶º»ºÎ Á¦Á¶ Operator Á¢¼ö±â°£ 2025.10.30 00½Ã ~ 2025.11.11 00½Ã ¸ðÁýºÐ¾ß »ý»ê/»ý»êÁ÷ (õ¾È 1/2°øÀå) / ¸ðÁý¿ä°­ ÂüÁ¶ °æ·Â ¹× Àοø ¹«°ü ¸í °í¿ë ÇüÅ Á¤±ÔÁ÷ ±Þ¿© Á¶°Ç ȸ»ç³»±Ô ÀÀ½Ã ÀÚ°Ý ¡á ÇʼöÁ¶°Ç - 3Á¶ 2±³´ë ±Ù¹«°¡´ÉÀÚ(5±Ù 2ÈÞ) • Day(06:00~14:00) / Swing(14:00~22:00) / GY(22:00~ÀÍÀÏ 06:00) / Day2(06:00~18:00) / GY2(18:00~ÀÍÀÏ 06:00) - °íµîÇб³ Á¹¾÷ ÀÌ»óÀÎ ÀÚ - ¹ÝµµÃ¼ ¼³ºñ Operation ¾÷¹« ¼öÇà °¡´ÉÀÚ ¡á ¿ì´ëÁ¶°Ç - ¹ÝµµÃ¼ ÈİøÁ¤ Operator °æÇèÀÚ ¿ì´ë • Front °øÁ¤ : Back Lab, Saw, Die Attectch, Wire Bonding • Back-end °øÁ¤ : Marking/Solder ball/Saw Sorter/Mold, SMT • Chip Final Test °øÁ¤ • Bump °øÁ¤ : Wafer Back Grinding, Laser Grooving, Wafer Saw, Plating, Sputter/Desum, Photo°øÁ¤ • DPS °øÁ¤ : BSC/Marking, PnP, Packin Á¦Ãâ ¼­·ù ÃÖÁ¾ÇÕ°Ý ÈÄ º°µµ¾È³»