 
Á¦¸ñ	[°øÃ¤] [½ÅÀÔ/°æ·Â] Á¦Á¶º»ºÎ Á¦Á¶ Operator
Á¢¼ö±â°£	2025.10.30 00½Ã ~ 2025.11.11 00½Ã
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- 3Á¶ 2±³´ë ±Ù¹«°¡´ÉÀÚ(5±Ù 2ÈÞ)
• Day(06:00~14:00) / Swing(14:00~22:00) / GY(22:00~ÀÍÀÏ 06:00) / Day2(06:00~18:00) / GY2(18:00~ÀÍÀÏ 06:00)
- °íµîÇб³ Á¹¾÷ ÀÌ»óÀÎ ÀÚ
- ¹ÝµµÃ¼ ¼³ºñ Operation ¾÷¹« ¼öÇà °¡´ÉÀÚ
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- ¹ÝµµÃ¼ ÈİøÁ¤ Operator °æÇèÀÚ ¿ì´ë
• Front °øÁ¤ : Back Lab, Saw, Die Attectch, Wire Bonding
• Back-end °øÁ¤ : Marking/Solder ball/Saw Sorter/Mold, SMT
• Chip Final Test °øÁ¤
• Bump °øÁ¤ : Wafer Back Grinding, Laser Grooving, Wafer Saw, Plating, Sputter/Desum, Photo°øÁ¤
• DPS °øÁ¤ : BSC/Marking, PnP, Packin
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