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[Æ÷Áö¼Ç] Specialist, Marketing

[Á÷¹«³»¿ë]
1. ±â¼ú Àü¹®¼º (Technical Expertise)
¾Æ½Ã¾Æ Áö¿ª Selective Wet Etch ¹× Clean °øÁ¤¿¡ ´ëÇÑ ±â¼ú Àü¹®°¡·Î¼­ »ç¾÷ ¿î¿µ Áö¿ø.
°í°´ Æò°¡(Customer Evaluation)¸¦ ÁÖµµÇϸç, °í°´ÀÇ ±¸¸Å µ¿±â ¹× ±â¼ú ¿ä±¸¿Í ÀÏÄ¡Çϵµ·Ï Á¤È®Çϰí Àü¹®ÀûÀ¸·Î ¼öÇà.

2. ¸ÅÃâ ¹× ½ÃÀå È®´ë (Revenue and Market Growth)
¾Æ½Ã¾Æ Áö¿ª¿¡¼­ EntegrisÀÇ SPI ¼ÒÀç ¼Ö·ç¼Ç ¸ÅÃâ ¼ºÀå ¹× ½ÃÀå Á¡À¯À² È®´ë¸¦ À§ÇÑ Àü·« °³¹ß ¹× ½ÇÇà.

3. ±â¼ú Áö¿ø ¹× Çù¾÷ (Technical Support and Collaboration)
°í°´»ç Á¦Ç° ÀÎÁõ(Customer Qualification) °úÁ¤¿¡¼­ ±â¼ú ¹× ÀÀ¿ë Áö¿ø Á¦°ø.
Account Manager¿Í Çù·ÂÇÏ¿© Á¦Ç° ÇÁ·¹Á¨Å×ÀÌ¼Ç ¹× ±â¼úÀû ³íÀÇ ¼öÇà.
Value Selling Process¸¦ Ȱ¿ëÇÏ¿© °í°´ ±âȸ¸¦ ¹ß±¼, °³¹ß, ¿ì¼±¼øÀ§È­.
Business Unit ¹× R&D ÆÀ°ú Çù·ÂÇÏ¿© Á¦Ç° ·Îµå¸ÊÀÌ °í°´ ¹× ¾÷°è ´ÏÁî¿Í Àü·«ÀûÀ¸·Î ÀÏÄ¡Çϵµ·Ï Á¶Á¤.

4. °í°´ °ü°è °ü¸® (Customer Relationship Management)
°í°´ÀÇ Wet °øÁ¤ ¹× Entegris Á¦Ç° °ü·Ã µ¥ÀÌÅͺ£À̽º ±¸Ãà ¹× À¯Áö.
Á¤±âÀûÀÎ °í°´ ¹ÌÆÃÀ» ÅëÇØ Áö¼ÓÀûÀÎ ¿ä±¸ »çÇ×À» ÆÄ¾ÇÇϰí, Account Manager¿Í Çù¾÷ÇÏ¿© °èÁ¤ °ü¸® °èȹ(Account Plan) ¼ö¸³.
Áö¿ª ³» Wet Etch ¹× Clean ±â¼ú °ü·Ã ÇÙ½É ±â¼ú ÀÚ¹®(Go-To Technical Resource) ¿ªÇÒ ¼öÇà.

5. ±³À° ¹× Áö½Ä °øÀ¯ (Education and Training)
°í°´°ú ³»ºÎ Á÷¿ø¿¡°Ô °ü·Ã °øÁ¤ ¼Ö·ç¼Ç(Process Solution) Áö½ÄÀ» ±³À° ¹× ÀüÆÄ.

6. Á¦Ç° Æ÷Áö¼Å´× ¹× ¶óÀÌÇÁ»çÀÌŬ °ü¸® (Product Positioning and Life Cycle Management)
Á¦Ç°ÀÇ Æ÷Áö¼Å´×°ú Àüü ¶óÀÌÇÁ»çÀÌŬÀ» °ü¸®ÇÏ¿© ½ÃÀå Á¡À¯À²À» À¯Áö ¹× °­È­.

7. ÆÀ Çù·Â ¹× ºñÁî´Ï½º ȸÀÇ (Team Collaboration and Business Meetings)
SPI ¸®´õ½Ê ÆÀ°ú ÇÔ²² »ç¾÷ ¸®ºä ¹ÌÆÃ Âü¿©.
Áö¿ª ¹× ±Û·Î¹ú ±âȸ °ËÅä(Local/Global Opportunity Review)¿¡¼­ Áö¿ª ´ëÇ¥ ¿ªÇÒ ¼öÇà.
°í°´°ú ±â¼ú ·Îµå¸Ê °ü·Ã ³íÀǸ¦ ÁÖµµÇϰí Àü·« Á¶¾ð Á¦°ø.
¿µ¾÷(Account), °ø±Þ¸Á(Supply Chain), ǰÁú(Quality) µî ÁÖ¿ä ±â´É ÆÀ°ú Çù¾÷ÇÏ¿© °í°´ ¿ä±¸»çÇ× ´ëÀÀ ¹× ¿î¿µ Áö¿ø.

[ÀÚ°Ý¿ä°Ç]
1. Çз ¹× °æ·Â (Education and Experience)
È­ÇÐ, È­ÇаøÇÐ, Àç·á°øÇÐ ¶Ç´Â °øÇÐ °ü·Ã Çлç ÇÐÀ§ ÀÌ»ó.
¹ÝµµÃ¼ °øÁ¤(Fab Environment), Àåºñ °ø±Þ»ç, ¼ÒÀç °ø±Þ»ç Áß Wet Etch ¹× Clean ºÐ¾ß 10³â ÀÌ»ó °æ·Â º¸À¯ÀÚ.
(¿ì´ë : ¼®»ç(Master) ¶Ç´Â ¹Ú»ç(Ph.D.) ÇÐÀ§ ¼ÒÁöÀÚ)

2. ±â¼ú ¿ª·® (Technical Skills)
÷´Ü Wafer Fab ȯ°æ(Advanced Logic, Memory Vertical/3D ±¸Á¶)¿¡¼­ Wet Etch ¹× Clean °øÁ¤ °³¹ß °æÇè º¸À¯ÀÚ ¼±È£.
ºÐ¼®Àû ¹®Á¦ ÇØ°á ´É·Â, Çù¾÷ Á᫐ ¸¶Àεå, ½ºÆ®·¹½º »óȲ¿¡¼­ÀÇ ¾ÈÁ¤µÈ ¾÷¹« ¼öÇà ´É·Â.
Ç¥¸é ºÐ¼®(Surface Analytical) ±â¼ú °æÇè º¸À¯ ½Ã ¿ì´ë.

3. ±âŸ ¿ª·® (Additional Skills)
ÃÖ¼ÒÇÑÀÇ °¨µ¶ ÇÏ¿¡¼­µµ ½º½º·Î ¾÷¹«¸¦ ÃßÁøÇÒ ¼ö ÀÖ´Â ÀÚ±âÁÖµµÀû ¾÷¹« ŵµ.
°­ÇÑ ÆÀ¿öÅ© ¹× Çù¾÷ ´É·Â Çʼö.
±â¼ú ¹ßÇ¥ÀÚ·á ÀÛ¼º ¹× ÇÁ·¹Á¨Å×ÀÌ¼Ç ¿ª·®.
³»ºÎ ¹× ¿ÜºÎ ´ë»ó ¸ðµÎ¿¡ ÀûÇÕÇÑ ¿µ¾î ÀÇ»ç¼ÒÅë ¹× ¹®¼­È­ ´É·Â.
¿µ¾î ¸»ÇÏ±â ¹× ÇÁ·¹Á¨Å×ÀÌ¼Ç ´É·Â 
¿µ¾÷ ¶Ç´Â °ü¸® °æÇè º¸À¯ÀÚ ¿ì´ë.

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